Image-sensing module

ABSTRACT

An image-sensing module includes a substrate unit, a light-transmitting unit, an image-sensing unit and a lens unit. The substrate unit includes at least one flexible substrate having at least one through opening. The light-transmitting unit includes at least one light-transmitting element disposed on the top surface of the flexible substrate and corresponding to the through opening. The image-sensing unit includes at least one image-sensing element disposed on the bottom surface of the light-transmitting element and embedded in the through opening, and the image-sensing element is electrically connected to the flexible substrate. The lens unit includes an opaque frame disposed on the top surface of the flexible substrate to surround the light-transmitting element and a lens positioned on the opaque frame to correspond to the light-transmitting element.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The instant disclosure relates to an image-sensing module, and moreparticularly, to an image-sensing module for reducing its wholethickness.

2. Description of Related Art

The advantage of CMOS (Complementary Metal-Oxide-Semiconductor) is lowpower consumption and small size, thus the CMOS image-sensing chippackage module can integrate into portable electronic device with smallsize such as mobile phone and notebook.

Referring to FIG. 1A to FIG. 1C, the prior art provides an image-sensingmodule, including: a hard substrate 1 a, an image sensor 2 a, aplurality of electronic elements 3 a, an anti-EMI (ElectromagneticInterference) element 4 a, and a USB connector 5 a. The image sensor 2 aand the electronic elements 3 a are electrically connected to the hardsubstrate 1 a. The image sensor 2 a is exposed from the first opening 40a of the anti-EMI element 4 a, and the hard substrate 1 a and theelectronic elements 3 a are encircled by the anti-EMI element 4 a.Hence, the thickness h1 of the hard substrate 1 a and the thickness h2of the anti-EMI element 4 a cannot be reduced, thus the whole thicknessof the image-sensing module of the prior art cannot be reduced.

SUMMARY OF THE INVENTION

One aspect of the instant disclosure relates to an image-sensing modulefor reducing the thickness and avoiding the electromagneticinterference.

One of the embodiments of the instant disclosure provides animage-sensing module, comprising: a substrate unit, a light-transmittingunit, an image-sensing unit and a lens unit. The substrate unit includesat least one flexible substrate, wherein the at least one flexiblesubstrate has at least one through opening. The light-transmitting unitincludes at least one light-transmitting element disposed on the topsurface of the at least one flexible substrate and corresponding to theat least one through opening. The image-sensing unit includes at leastone image-sensing element disposed on the bottom surface of the at leastone light-transmitting element and embedded in the at least one throughopening, wherein the at least one image-sensing element is electricallyconnected to the at least one flexible substrate. The lens unit includesan opaque frame disposed on the top surface of the at least one flexiblesubstrate to surround the at least one light-transmitting element and alens positioned on the opaque frame to correspond to the at least onelight-transmitting element.

Furthermore, the at least one flexible substrate has a main portion andat least two extending portions extended upwardly from two oppositelateral sides of the main portion, and the at least two extendingportions are respectively close to two opposite lateral sides of thelens unit. The substrate unit includes a plurality of electronicelements disposed on the at least one flexible substrate, and two of theelectronic elements are electrically connected to each other through afirst conductive track disposed on the main portion, or the substrateunit includes a plurality of electronic elements disposed on the atleast one flexible substrate, and two of the electronic elements areelectrically connected to each other through a first conductive tracksimultaneously disposed on the main portion and one of the at least twoextending portions.

Moreover, the image-sensing module further comprises a conductive unitincluding a plurality of first conductive bodies disposed between the atleast one light-transmitting element and the at least one flexiblesubstrate and a plurality of second conductive bodies disposed betweenthe at least one light-transmitting element and the at least oneimage-sensing element. The at least one flexible substrate has at leastone first conductive track disposed on the top surface thereof, the atleast one light-transmitting element has at least one second conductivetrack disposed on the bottom surface thereof and electrically connectedto the at least one first conductive track through one of the firstconductive bodies, and the at least one image-sensing element has atleast one third conductive track disposed on the top surface thereof andelectrically connected to the at least one second conductive trackthrough one of the second conductive bodies.

In addition, the image-sensing module further comprises a connectionunit including a plurality of connection elements disposed between theat least one light-transmitting element and the at least oneimage-sensing element. The bottom surface of the at least one flexiblesubstrate are flushed with the bottom surface of the at least oneimage-sensing element.

Another one of the embodiments of the instant disclosure provides animage-sensing module, comprising: a substrate unit, a light-transmittingunit and an image-sensing unit. The substrate unit includes at least oneflexible substrate, wherein the at least one flexible substrate has atleast one through opening. The light-transmitting unit includes at leastone light-transmitting element disposed on the top surface of the atleast one flexible substrate and corresponding to the at least onethrough opening. The image-sensing unit includes at least oneimage-sensing element disposed on the bottom surface of the at least onelight-transmitting element and embedded in the at least one throughopening, wherein the at least one image-sensing element is electricallyconnected to the at least one flexible substrate.

Yet another one of the embodiments of the instant disclosure provides animage-sensing module, comprising: a substrate unit, a light-transmittingunit and an image-sensing unit. The substrate unit includes at least oneflexible substrate, wherein the at least one flexible substrate has atleast one through opening, and the at least one flexible substrate hasat least one first conductive track disposed on the top surface thereofThe light-transmitting unit includes at least one light-transmittingelement disposed on the top surface of the at least one flexiblesubstrate and corresponding to the at least one through opening, whereinthe at least one light-transmitting element has at least one secondconductive track disposed on the bottom surface thereof and electricallyconnected to the at least one first conductive track through a firstconductive body. The image-sensing unit includes at least oneimage-sensing element disposed on the bottom surface of the at least onelight-transmitting element and embedded in the at least one throughopening, wherein the at least one image-sensing element has at least onethird conductive track disposed on the top surface thereof andelectrically connected to the at least one second conductive trackthrough a second conductive body, thus the at least one image-sensingelement is electrically connected to the at least one flexiblesubstrate.

Therefore, because the at least one image-sensing element can bedisposed on the bottom surface of the at least one light-transmittingelement and embedded in the at least one through opening, the thicknessof the image-sensing module can be reduced.

To further understand the techniques, means and effects of the instantdisclosure applied for achieving the prescribed objectives, thefollowing detailed descriptions and appended drawings are herebyreferred, such that, through which, the purposes, features and aspectsof the instant disclosure can be thoroughly and concretely appreciated.However, the appended drawings are provided solely for reference andillustration, without any intention to limit the instant disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a top, schematic view of the image-sensing module of theprior art;

FIG. 1B is a front, schematic view of the image-sensing module of theprior art;

FIG. 1C is a cross-sectional, schematic view along line 1C-1C of FIG.1B;

FIG. 2A shows a top, schematic view of the image-sensing module beforebending the flexible substrate according to the first embodiment of theinstant disclosure;

FIG. 2B shows a cross-sectional view taken along the section line 2B-2Bof FIG. 2A;

FIG. 2C shows a lateral, schematic view of the image-sensing modulebefore bending the flexible substrate according to the first embodimentof the instant disclosure;

FIG. 2D shows a lateral, schematic view of the image-sensing moduleafter bending the flexible substrate according to the first embodimentof the instant disclosure;

FIG. 3 shows a top, schematic view of the image-sensing module beforebending the flexible substrate according to the second embodiment of theinstant disclosure;

FIG. 4 shows a partial, cross-sectional, schematic view of theimage-sensing module before bending the flexible substrate according tothe third embodiment of the instant disclosure;

FIG. 5 shows a partial, cross-sectional, schematic view of theimage-sensing module before bending the flexible substrate according tothe fourth embodiment of the instant disclosure; and

FIG. 6 shows a partial, cross-sectional, schematic view of theimage-sensing module before bending the flexible substrate according tothe fifth embodiment of the instant disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment

Referring to FIG. 2A to FIG. 2D, where the first embodiment of theinstant disclosure provides an image-sensing module Z, comprising: asubstrate unit 1, a light-transmitting unit 2, an image-sensing unit 3and a lens unit 4.

Referring to FIG. 2A and FIG. 2B, the substrate unit 1 includes at leastone flexible substrate 10, and the flexible substrate 10 has at leastone through opening 100. The light-transmitting unit 2 includes at leastone light-transmitting element 20 disposed on the top surface of theflexible substrate 10 and corresponding to the through opening 100. Theimage-sensing unit 3 includes at least one image-sensing element 30disposed on the bottom surface of the light-transmitting element 20 andembedded in the through opening 100, where the image-sensing element 30is electrically connected to the flexible substrate 10. The lens unit 4includes an opaque frame 40 disposed on the top surface of the flexiblesubstrate 10 to surround the light-transmitting element 20 and a lens 41positioned on the opaque frame 40 to correspond to thelight-transmitting element 20. For example, the flexible substrate 10may be a flexible circuit substrate. The light-transmitting element 20can be made of light-transmitting material or transparent material, suchas glass. The image-sensing element 30 may be a sensor for capturingimages, such as a CMOS (Complementary Metal-Oxide-Semiconductor) sensor,and the bottom surface of the flexible substrate 10 can be flushed withthe bottom surface of the image-sensing element 30. However, theflexible substrate 10, the light-transmitting element 20 and theimage-sensing element 30 used in the first embodiment are merelyexamples and are not meant to limit the instant disclosure.

For example, referring to FIG. 2A, FIG. 2C and FIG. 2D, when theflexible substrate 10 has not been bent yet (as shown in FIG. 2A andFIG. 2C), the flexible substrate 10 has a main portion 1 OA and at leasttwo extending portions 10B extended outwardly from two opposite lateralsides of the main portion 10A and parallel to the main portion 10A. Whenthe flexible substrate 10 is bent along two bending lines L as shown inFIG. 2A and FIG. 2D, the flexible substrate 10 has a main portion 10Aand at least two extending portions 10B extended upwardly from twoopposite lateral sides of the main portion 10A. The two extendingportions 10B are respectively close to two opposite lateral sides of thelens unit 4, and the electromagnetic interference (EMI) of the instantdisclosure can be reduced by using the two extending portions 10B. Inaddition, referring to FIG. 2A, the substrate unit 1 further includes aplurality of electronic elements 11 disposed on the flexible substrate10, and two of the electronic elements 11 are electrically connected toeach other through a first conductive track W1 only disposed on the mainportion 10A. However, the substrate unit 1 used in the first embodimentis merely example and is not meant to limit the instant disclosure.

Moreover, referring to FIG. 2A and FIG. 2B, The image-sensing module Zfurther comprises: a conductive unit 5 including a plurality of firstconductive bodies 51 disposed between the light-transmitting element 20and the flexible substrate 10 and a plurality of second conductivebodies 52 disposed between the light-transmitting element 20 and theimage-sensing element 30, and each first conductive body 51 and eachsecond conductive body 52 may be solder balls or solder paste. Moreover,the flexible substrate 10 has at least one first conductive track W1disposed on the top surface thereof, the light-transmitting element 20has at least one second conductive track W2 disposed on the bottomsurface thereof and electrically connected to the first conductive trackW1 through one of the first conductive bodies 51, and the image-sensingelement 30 has at least one third conductive track W3 disposed on thetop surface thereof and electrically connected to the second conductivetrack W2 through one of the second conductive bodies 52, thus theimage-sensing element 30 can sequentially pass through the thirdconductive track W3, the corresponding second conductive body 52, thesecond conductive track W2, the corresponding first conductive body 51and the first conductive track W1 to electrically connect to theflexible substrate 10. Of course, the first conductive body 51 and thesecond conductive body 52 can be replaced by a conductive substance (notshown) connected between the first conductive track W1 of the flexiblesubstrate 10, the second conductive track W2 of the light-transmittingelement 20 and the third conductive track W3 of the image-sensingelement 30 or between the first conductive track W1 of the flexiblesubstrate 1 and the third conductive track W3 of the image-sensingelement 30, thus the image-sensing element 30 can electrically connectto the flexible substrate 10 through the third conductive track W3, theconductive substance (not shown) and the first conductive track W1.However, the conductive unit 5 used in the first embodiment is merelyexample and is not meant to limit the instant disclosure. In otherwords, the image-sensing element 30 can electrically connect to theflexible substrate 10 by any connection method.

Furthermore, referring to FIG. 2A and FIG. 2B, the image-sensing moduleZ further comprising: a connection unit 6 including a plurality ofconnection elements 60 disposed between the light-transmitting element20 and the image-sensing element 30, thus the image-sensing element 30can be firmly fixed on the bottom surface of the light-transmittingelement 20. For example, each connection element 60 may be an adhesivesubstance. Of course, the connection elements 60 can be replaced by asingle surrounding connection element 60. However, the connection unit 6used in the first embodiment is merely example and is not meant to limitthe instant disclosure.

Second Embodiment

Referring to FIG. 3, where the second embodiment of the instantdisclosure provides an image-sensing module Z, comprising: a substrateunit 1, a light-transmitting unit (not shown), an image-sensing unit(not shown) and a lens unit 4. Comparing FIG. 3 and FIG. 2A, thedifference between the second embodiment and the first embodiment is asfollows: in the second embodiment, the substrate unit 1 further includesa plurality of electronic elements 11 disposed on the flexible substrate10, and two of the electronic elements 11 are electrically connected toeach other through a first conductive track W1 simultaneously disposedon the main portion 10A and one of the two extending portions 10B. Inother words, any two of the electronic elements 11 can be electricallyconnected to each other through the first conductive track W1 that isonly disposed on the main portion 10A (as shown in the first embodimentof FIG. 2A) or is simultaneously disposed on the main portion 10A andone of the two extending portions 10B (as shown in the second embodimentof FIG. 3).

Third Embodiment

Referring to FIG. 4, where the second embodiment of the instantdisclosure provides an image-sensing module Z, comprising: a substrateunit 1, a light-transmitting unit 2, an image-sensing unit 3 and a lensunit 4. The substrate unit 1 includes at least one flexible substrate10, and the flexible substrate 10 has at least one through opening 100.The light-transmitting unit 2 includes at least one light-transmittingelement 20 disposed on the top surface of the flexible substrate 10 andcorresponding to the through opening 100. The image-sensing unit 3includes at least one image-sensing element 30 disposed on the bottomsurface of the light-transmitting element 20 and embedded in the throughopening 100, where the image-sensing element 30 is electricallyconnected to the flexible substrate 10. The lens unit 4 includes anopaque frame 40 disposed on the top surface of the flexible substrate 10to surround the light-transmitting element 20 and a lens 41 positionedon the opaque frame 40 to correspond to the light-transmitting element20.

Comparing FIG. 4 and FIG. 2B, the difference between the thirdembodiment and the first embodiment is as follows: in the thirdembodiment, the bottom surface of the flexible substrate 10 is notflushed with the bottom surface of the image-sensing element 30. Forexample, the top surface of the image-sensing element 30 is convexoutside the through opening 100 and the bottom surface of theimage-sensing element 30 is concave inside the through opening 100, thuswhen the image-sensing module Z is disposed on any carrier (not shown),the image-sensing element 30 can be enclosed totally.

Fourth Embodiment

Referring to FIG. 5, where the fourth embodiment of the instantdisclosure provides an image-sensing module Z, comprising: a substrateunit 1, a light-transmitting unit 2, an image-sensing unit 3 and a lensunit 4. The substrate unit 1 includes at least one flexible substrate10, and the flexible substrate 10 has at least one receiving groove100′. The light-transmitting unit 2 includes at least onelight-transmitting element 20 disposed on the top surface of theflexible substrate 10 and corresponding to the receiving groove 100′.The image-sensing unit 3 includes at least one image-sensing element 30disposed on the bottom surface of the light-transmitting element 20 andembedded in the receiving groove 100′, where the image-sensing element30 is electrically connected to the flexible substrate 10. The lens unit4 includes an opaque frame 40 disposed on the top surface of theflexible substrate 10 to surround the light-transmitting element 20 anda lens 41 positioned on the opaque frame 40 to correspond to thelight-transmitting element 20.

Comparing FIG. 5 and FIG. 4, the difference between the fourthembodiment and the third embodiment is as follows: in the fourthembodiment, the through opening 100 is replaced by the receiving groove100′, thus when the image-sensing element 30 is disposed on the bottomsurface of the light-transmitting element 20 and embedded in thereceiving groove 100′, the image-sensing element 30 can be enclosedtotally.

Fifth Embodiment

Referring to FIG. 6, where the fifth embodiment of the instantdisclosure provides an image-sensing module Z, comprising: a substrateunit 1, a light-transmitting unit 2, an image-sensing unit 3 and a lensunit 4. The substrate unit 1 includes at least one flexible substrate10, and the flexible substrate 10 has at least one through opening 100.The light-transmitting unit 2 includes at least one light-transmittingelement 20 disposed on the top surface of the flexible substrate 10 andcorresponding to the through opening 100. The image-sensing unit 3includes at least one image-sensing element 30 disposed on the bottomsurface of the light-transmitting element 20 and embedded in the throughopening 100, where the image-sensing element 30 is electricallyconnected to the flexible substrate 10. The lens unit 4 includes anopaque frame 40 disposed on the top surface of the flexible substrate 10to surround the light-transmitting element 20 and a lens 41 positionedon the opaque frame 40 to correspond to the light-transmitting element20.

Comparing FIG. 6 and FIG. 2B, the difference between the fifthembodiment and the first embodiment is as follows: in the fifthembodiment, the bottom surface of the flexible substrate 10 is notflushed with the bottom surface of the image-sensing element 30. Forexample, the top surface of the image-sensing element 30 is concaveinside the through opening 100 and the bottom surface of theimage-sensing element 30 is convex outside the through opening 100, thusone part of the image-sensing element 30 can be exposed from the throughopening 100.

In conclusion, because the at least one image-sensing element can bedisposed on the bottom surface of the at least one light-transmittingelement and embedded in the at least one through opening, the thicknessof the image-sensing module can be reduced.

The above-mentioned descriptions merely represent the preferredembodiments of the instant disclosure, without any intention or abilityto limit the scope of the instant disclosure which is fully describedonly within the following claims. Various equivalent changes,alterations or modifications based on the claims of instant disclosureare all, consequently, viewed as being embraced by the scope of theinstant disclosure.

1. An image-sensing module, comprising: a substrate unit including atleast one flexible substrate, wherein the at least one flexiblesubstrate has a main portion and at least two extending portionsrespectively and upwardly extended from two opposite lateral sides ofthe main portion, and the main portion has at least one through openingpassing therethrough; a light-transmitting unit including at least onelight-transmitting element disposed on the top surface of the at leastone flexible substrate and corresponding to the at least one throughopening, wherein the at least one light-transmitting element iselectrically connected to the at least one flexible substrate through aplurality of first conductive bodies; an image-sensing unit including atleast one image-sensing element disposed on the bottom surface of the atleast one light-transmitting element and embedded in the at least onethrough opening, wherein the at least one image-sensing element iselectrically connected to the at least one flexible substrate through aplurality of second conductive bodies; a lens unit including an opaqueframe disposed on the top surface of the at least one flexible substrateto surround the at least one light-transmitting element and a lenspositioned on the opaque frame to correspond to the at least onelight-transmitting element, wherein the lens unit is disposed on themain portion and between the at least two extending portions, and thelens unit has two opposite lateral sides respectively separated from theat least two extending portions; and a connection unit including aplurality of adhesive substances separated from the second conductivebodies and disposed between the at least one light-transmitting elementand the at least one image-sensing element for firmly fixing the atleast one image-sensing element on the bottom surface of the at leastone light-transmitting element and exposing the at least oneimage-sensing element from the at least one through opening of the atleast one flexible substrate.
 2. (canceled)
 3. The image-sensing moduleof claim 1, wherein the substrate unit includes a plurality ofelectronic elements disposed on the at least one flexible substrate, andtwo of the electronic elements are electrically connected to each otherthrough a first conductive track disposed on the main portion.
 4. Theimage-sensing module of claim 1, wherein the substrate unit includes aplurality of electronic elements disposed on the at least one flexiblesubstrate, and two of the electronic elements are electrically connectedto each other through a first conductive track simultaneously disposedon the main portion and one of the at least two extending portions. 5.The image-sensing module of claim 1, further comprising: a conductiveunit including a plurality of first conductive bodies disposed betweenthe at least one light-transmitting element and the at least oneflexible substrate and a plurality of second conductive bodies disposedbetween the at least one light-transmitting element and the at least oneimage-sensing element.
 6. The image-sensing module of claim 5, whereinthe at least one flexible substrate has at least one first conductivetrack disposed on the top surface thereof, the at least onelight-transmitting element has at least one second conductive trackdisposed on the bottom surface thereof and electrically connected to theat least one first conductive track through one of the first conductivebodies, and the at least one image-sensing element has at least onethird conductive track disposed on the top surface thereof andelectrically connected to the at least one second conductive trackthrough one of the second conductive bodies.
 7. (canceled)
 8. Theimage-sensing module of claim 1, wherein the bottom surface of the atleast one flexible substrate are flushed with the bottom surface of theat least one image-sensing element.
 9. An image-sensing module,comprising: a substrate unit including at least one flexible substrate,wherein the at least one flexible substrate has at least one throughopening; a light-transmitting unit including at least onelight-transmitting element disposed on the top surface of the at leastone flexible substrate and corresponding to the at least one throughopening, wherein the at least one light-transmitting element iselectrically connected to the at least one flexible substrate through aplurality of first conductive bodies; an image-sensing unit including atleast one image-sensing element disposed on the bottom surface of the atleast one light-transmitting element and embedded in the at least onethrough opening, wherein the at least one image-sensing element iselectrically connected to the at least one flexible substrate through aplurality of second conductive bodies; and a connection unit including aplurality of adhesive substances separated from the second conductivebodies and disposed between the at least one light-transmitting elementand the at least one image-sensing element for firmly fixing the atleast one image-sensing element on the bottom surface of the at leastone light-transmitting element and exposing the at least oneimage-sensing element from the at least one through opening of the atleast one flexible substrate.
 10. (canceled)
 11. An image-sensingmodule, comprising: a flexible substrate having a through openingpassing therethrough; a light-transmitting element disposed on the topsurface of the flexible substrate and above the through opening, whereinthe light-transmitting element is electrically connected to the flexiblesubstrate through a plurality of first conductive bodies; animage-sensing element disposed on the bottom surface of thelight-transmitting element and disposed in the through opening, whereinthe image-sensing element is electrically connected to thelight-transmitting element through a plurality of second conductivebodies; and a connection unit including a plurality of adhesivesubstances separated from the second conductive bodies and disposedbetween the light-transmitting element and the image-sensing element forfirmly fixing the image-sensing element on the bottom surface of thelight-transmitting element and exposing the image-sensing element fromthe through opening of the flexible substrate; wherein the image-sensingelement is suspended from the light-transmitting element through theadhesive substances to form an air gap between an inner surface of thethough opening and the image-sensing element.